• Preface
• Table of Contents
• Index
• References
• Media Response
• Ferrites
• Piezoelectric ceramics
• Piezoelectric crystals
• Transformers
• Sensors, Transducers, ...

The industrial production of crystals, for AT cutting as well as for other cuttings, is done mostly by the following procedure:

1. Gross cutting of the crystal for a given cutting angle,
2. Cutting of a chop of crystal with a special angle,
3. Measurement of the angle, of the crystal chop, in degrees, minutes, seconds, with x-rays for the success of the required frequency,
4. Exterior process (continual rubbing) in order to avoid other vibration modes except for the required,
5. Placing of mask on the crystal chop (0.1μm) for achieving the required frequency (lapping),
6. Specification, on the chop, of the required vibration mode (beveling), only for using the crystal in low frequencies,
7. Chemical removal of the mask created on the chop in steps 5 and 6 (etching),
8. Manufacture of electrodes on the chop (from Al, Ag, Au etc.) with sublimation by a special device,
9. Propping of the crystal chop on a fixed basis, with conductive acetic glue or conductive cement,
10. Placing of more electrode material, on the basic electrode, for micrometric adjustment of the frequency of the crystal in the area of resonance frequencies,
11. Mechanical stamping of the crystal with its basis, in very low temperature and N and R environment for avoiding future oxidation,
12. Final testing,
13. Imprinting of the elements on the component jacket.